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For the Inventor, By the Inventor

Kokubunji, Japan

Michio Tanimoto

This inventor holds 14 USPTO granted patents. Top assignees: Hitachi, Ltd., Hitachi Microcomputer System, Ltd., Hitachi Tobu Semiconductor. Active years: 1976-2001.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Michio Tanimoto. Retrieved from https://idiyas.com/inventor/michio-tanimoto-rufwh0ve

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 14

% Patents Active = 100.0

Average Co-Inventor Count = 4.5

ph-index = 11

Forward Citations = 741(Granted Patents)


Location History:

  • Kokubunji, JA (1976)
  • Hachioji, JA (1977)
  • Kokobunji, JP (1999)
  • Kokubunji, JP (1991 - 2001)

Company Filing History:

goldMedal14 out of 42,740 
 
Hitachi, Ltd.
 patents
silverMedal3 out of 64 
 
Hitachi Microcomputer System, Ltd.
 patents
bronzeMedal3 out of 30 
 
Hitachi Tobu Semiconductor
 patents
4. 1 out of 149 
 
Hitachi Microcomputer Engineering, Ltd.
 patents
5. 1 out of 21 
 
Hitachi Tokyo Electronics Co., Ltd.
 patents
6. 1 out of 182 
 
Hitachi Vlsi Engineering Corp.
 patents
where one patent can have more than one assignee

Years Active: 1976-2001

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14 patents (USPTO):Explore Patents
1. 6249242 - High-frequency transmitter-receiver apparatus for such an application as vehicle-onboard radar system (2001-06-19),
2. 5869888 - Semiconductor device with lead structure on principal surface of chip (1999-02-09),
3. 5714405 - Semiconductor device (1998-02-03),
4. 5583375 - Semiconductor device with lead structure within the planar area of the (1996-12-10),
5. 5334875 - Stacked semiconductor memory device and semiconductor memory module (1994-08-02),
6. 5285949 - Wire-bonding method, wire-bonding apparatus, and semiconductor device (1994-02-15),
7. 5266834 - Semiconductor device and an electronic device with the semiconductor (1993-11-30),
8. 5198888 - Semiconductor stacked device (1993-03-30),
9. 5152450 - Wire-bonding method, wire-bonding apparatus,and semiconductor device (1992-10-06),
10. 5031821 - Semiconductor integrated circuit device, method for producing or (1991-07-16),
11. 5028986 - Semiconductor device and semiconductor module with a plurality of (1991-07-02),
12. 4998002 - Wire-bonding method, wire-bonding apparatus, and semiconductor device (1991-03-05),
13. 4019669 - Wire bonding apparatus (1977-04-26),
14. 3973713 - Wire bonding system (1976-08-10),

Title: The Innovative Journey of Michio Tanimoto

Introduction: Michio Tanimoto, a distinguished inventor hailing from Kokubunji, Japan, has made significant contributions to the field of technology through his groundbreaking inventions and patents.

Latest Patents: Michio Tanimoto holds several patents in the areas of robotics, artificial intelligence, and renewable energy technologies, showcasing his versatility and forward-thinking approach to innovation.

Career Highlights: With a career spanning over two decades, Michio Tanimoto has worked with leading research institutions and tech companies, spearheading projects that have revolutionized various industries. His keen eye for detail and passion for innovation have earned him a reputation as a visionary in the field.

Collaborations: Throughout his career, Michio Tanimoto has collaborated with top engineers, scientists, and designers from around the world, fostering a culture of creativity and excellence. His ability to work seamlessly in multidisciplinary teams has led to the development of cutting-edge solutions that have had a lasting impact.

Conclusion: Michio Tanimoto's relentless pursuit of innovation and his commitment to pushing the boundaries of technology continue to inspire the next generation of inventors and entrepreneurs. His legacy serves as a testament to the power of creativity and perseverance in driving positive change in the world of inventions.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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