The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 16, 1991
Filed:
Aug. 16, 1989
Applicant:
Inventors:
Tsuyoshi Kaneda, Tokyo, JP;
Susumu Okikawa, Ohme, JP;
Hiroshi Mikino, Tachikawa, JP;
Hiroshi Watanabe, Higashimurayama, JP;
Toshihiro Satou, Machida, JP;
Atsushi Onodera, Iruma, JP;
Michio Tanimoto, Kokubunji, JP;
Assignees:
Hitachi, Ltd., Tokyo, JP;
Hitachi Microcomputer Engineering Ltd., Tokyo, JP;
Hitachi Tokyo Electronics Co., Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L / ; B23K / ;
U.S. Cl.
CPC ...
228110 ; 228111 ; 228219 ; 228179 ;
Abstract
The present invention is characterized in that, in a ball wedge bonding using a fine bonding wire precoated with a thin insulating layer, ultrasonic vibration is applied to a capillary to effect the delivery of the wire smoothly during movement of the capillary to a second bonding point while delivering the wire after ball bonding at a first bonding point.