Susumu Okikawa

Title: Susumu Okikawa: Innovator in Wire Bonding Technology

Introduction

Susumu Okikawa is a notable inventor based in Ohme, Japan, recognized for his contributions to wire bonding technology. He holds a total of 12 patents, showcasing his innovative spirit and technical expertise in the field of semiconductor devices.

Latest Patents

Okikawa's latest patents include a wire-bonding method, a wire-bonding apparatus, and a semiconductor device. His inventions focus on employing a coated wire, where the surface of a metal wire is coated with an insulator. The wire bonding method involves forming a mixed gas of a combustible gas and a temperature-controlling gas to lower the combustion temperature. This innovative approach allows for the removal of the insulator coating material from the coated wire at the bonding part, ensuring that the surface of the metal wire is denuded effectively. The process utilizes flames produced by the combustion of the mixed gas, executed by an insulator removal torch. Furthermore, the method includes forming a metal ball on the front end of the coated wire and joining it to an external terminal of a semiconductor chip, thereby enhancing the reliability of the bonding process.

Career Highlights

Throughout his career, Okikawa has worked with prominent companies such as Hitachi, Ltd. and Hitachi Microcomputer Engineering, Ltd. His experience in these organizations has significantly contributed to his expertise in semiconductor technology and wire bonding methods.

Collaborations

Okikawa has collaborated with notable colleagues, including Hiroshi Mikino and Michio Tanimoto. Their collective efforts have further advanced the field of wire bonding technology.

Conclusion

Susumu Okikawa's innovative contributions to wire bonding technology have made a significant impact in the semiconductor industry. His patents reflect a deep understanding of the complexities involved in wire bonding processes, ensuring improved reliability and efficiency in semiconductor devices.