The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 13, 1988
Filed:
Feb. 09, 1988
Applicant:
Inventors:
Susumu Okikawa, Ohme, JP;
Akira Miyairi, Musashino, JP;
Assignee:
Hitachi, Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
357 70 ; 357 72 ;
Abstract
A resin encapsulated type semiconductor device is manufactured by using a lead frame in which a stress relaxation portion is formed near the connection portion between the tab suspending the lead and the tab according to this invention, whereby stress concentration to the tab at the connection portion of the tab suspending lead can be prevented even when the tab as the pellet mounting portion is thermally expanded thereby preventing crackings from resulting in the semiconductor pellets.