The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 11, 1990
Filed:
Dec. 17, 1987
Makoto Nakajima, Takasaki, JP;
Yoshio Ohashi, Tamamura, JP;
Toshio Chuma, Takasaki, JP;
Kazuo Hatori, Tamamura, JP;
Isao Araki, Tamamura, JP;
Masahiro Koizumi, Hitachi, JP;
Jin Onuki, Hitachi, JP;
Hitoshi Suzuki, Hitachi, JP;
Susumu Okikawa, Ohme, JP;
Hitachi, Ltd., Tokyo, JP;
Abstract
The present invention concerns a semiconductor device and a process for producing semiconductor device, as well as a wire bonding device used therefor. In accordance with the present invention, a ball formed at the top end of a bonding wire is sphericalized by electric discharge within a reducing gas atmosphere at a high temperature from 100.degree. C. to 200.degree. C. By using the ball of the bonding wire formed under such a condition to the bonding of the bonding pad of a semiconductor pellet, it is possible to conduct highly reliable ball bonding with excellent bondability and with no development of cracks or the like in the semiconductor pellet, as well as to obtain a highly reliable semiconductor device, that is, LSI or IC.