Company Filing History:
Years Active: 1990
Title: The Innovations of Toshio Chuma
Introduction
Toshio Chuma is a notable inventor based in Takasaki, Japan. He has made significant contributions to the field of semiconductor technology. His work has led to advancements that enhance the reliability and efficiency of semiconductor devices.
Latest Patents
Toshio Chuma holds a patent for a semiconductor device and its production process. The patent, which focuses on a wire bonding device, describes a method where a ball formed at the top end of a bonding wire is sphericalized by electric discharge within a reducing gas atmosphere at high temperatures ranging from 100°C to 200°C. This innovative approach allows for highly reliable ball bonding with excellent bondability, minimizing the risk of cracks in semiconductor pellets. The resulting semiconductor devices, such as LSIs or ICs, demonstrate enhanced reliability.
Career Highlights
Chuma is associated with Hitachi, Ltd., a leading company in technology and innovation. His work at Hitachi has allowed him to contribute to cutting-edge developments in semiconductor devices. His expertise in this area has positioned him as a key figure in the industry.
Collaborations
Throughout his career, Toshio Chuma has collaborated with esteemed colleagues, including Makoto Nakajima and Yoshio Ohashi. These collaborations have fostered an environment of innovation and have led to significant advancements in their respective fields.
Conclusion
Toshio Chuma's contributions to semiconductor technology through his innovative patent and work at Hitachi, Ltd. highlight his importance as an inventor. His advancements in wire bonding techniques have paved the way for more reliable semiconductor devices.