The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 31, 1978
Filed:
Mar. 03, 1976
Applicant:
Inventors:
Susumu Okikawa, Ohme, JP;
Osamu Yukawa, Kodaira, JP;
Hiroshi Mikino, Tachikawa, JP;
Yoshio Nonaka, Kodaira, JP;
Assignee:
Hitachi, Ltd., , JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C22F / ;
U.S. Cl.
CPC ...
148 / ; 29590 ; 75153 ; 75154 ; 75159 ; 148 / ; 148 13 ; 148 132 ; 148 32 ;
Abstract
A method of providing a silicon semiconductor pellet with a heat sink and a semiconductor device with such a heat sink. The heat sink to which the pellet is bonded with a eutectic alloy of gold and silicon interposed therebetween consists mainly of copper and contains a small amount of a metal other than copper and has been subjected to an annealing treatment.