The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 20, 1982

Filed:

Nov. 21, 1979
Applicant:
Inventors:

Hiromichi Suzuki, Tokyo, JP;

Susumu Okikawa, Ohme, JP;

Assignee:

Hitachi, Ltd., Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L / ; H01L / ; H01L / ;
U.S. Cl.
CPC ...
357 81 ; 357 72 ; 357 65 ; 357 68 ;
Abstract

A semiconductor device comprising a metallic base plate whose side surfaces are formed with cut-away portions having circular arc-shaped parts, a semiconductor element which is connected to the surface of the metallic base plate, and a resin which lies in contact with the cut-away portions and which seals the semiconductor element.


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