The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 03, 1998
Filed:
Sep. 26, 1996
Kunihiro Tsubosaki, Hino, JP;
Michio Tanimoto, Kokubunji, JP;
Kunihiko Nishi, Kokubunji, JP;
Masahiro Ichitani, Kodaira, JP;
Shunji Koike, Kodaira, JP;
Kazunari Suzuki, Tokyo, JP;
Ryosuke Kimoto, Tachikawa, JP;
Ichiro Anjoh, Koganei, JP;
Taisei Jin, Musashino, JP;
Akihiko Iwaya, Fuchuu, JP;
Gen Murakami, Tama, JP;
Masamichi Ishihara, Hamura, JP;
Junichi Arita, Musashino, JP;
Hitachi, Ltd., Tokyo, JP;
Hitachi Microcomputer Systems, Ltd., Tokyo, JP;
Abstract
A semiconductor device having inner leads secured via insulating adhesive films to the principal surface of a semiconductor chip and electrically connected to the respective external terminals of the semiconductor chip. The semiconductor device that can be about the size of the chip is so configured that an outer lead is continuously extended from each inner lead up to the rear surface opposite to the principal surface of the semiconductor chip in order to hold the leads and an external device in conduction.