The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 30, 1993
Filed:
Dec. 20, 1990
Toshio Sugano, Kokubunji, JP;
Kohji Nagaoka, Tobu, JP;
Seiichiro Tsukui, Komoro, JP;
Yoshiaki Wakashima, Kawasaki, JP;
Michio Tanimoto, Kokubunji, JP;
Masayuki Watanabe, Yokohama, JP;
Suguru Sakaguchi, Chigasaki, JP;
Kunihiko Nishi, Kokubunji, JP;
Aizo Kaneda, Yokohama, JP;
Kohji Serizawa, Fujisawa, JP;
Michiharu Honda, Yokohama, JP;
Tohru Yoshida, Yamato, JP;
Takeshi Komaru, Tachikawa, JP;
Atsushi Nakamura, Kokubunji, JP;
Hitachi, Ltd., Tokyo, JP;
Hitachi Tobu Semiconductor, Ltd., Saitama, JP;
Abstract
There is a trend to increase that area of a device requiring a memory of large capacity, which is occupied by a semiconductor memory. This trend obstructs reduction of the size of the device. The present invention contemplates to provide a memory which can have a high integration, a high density and a large capacity while minimizing the mounting area. In order to achieve this memory, the TAB (Tape Automated Bonding) of the prior art is mounted on an electrically conductive connector, and a plurality of structures composed of the TAB and the connector are stacked. Moreover, the connector mounting the TAB thereon is constructed such that the independent terminals of the stacked TABs may not be shorted.