The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 30, 1993
Filed:
Jul. 21, 1992
Kunihiko Nishi, Kokubunji, JP;
Michio Tanimoto, Kokubunji, JP;
Toshihiro Yasuhara, Kokubunji, JP;
Katsuhiro Tabata, Higashimurayama, JP;
Yasuhiro Yoshikawa, Kodaira, JP;
Isao Akima, Fussa, JP;
Souichi Kunito, Kodaira, JP;
Toshio Nosaka, Musashimurayama, JP;
Hideaki Nakamura, Kodaira, JP;
Hitachi Ltd., Tokyo, JP;
Hitachi VSLI Engineering Corp., Tokyo, JP;
Abstract
A package is provided for achieving higher packing density and higher circuit integration of memories, in particular, a structure is provided having a plurality of thin, surface mount packages which are stacked up. Each of the laminated packages includes a semiconductor pellet, leads fixed to the front surface of the pellet, a radiating plate fixed to the rear surface of the same, and a resin mold member. To achieve a stabilized laminated structure, the mold member is shaped into a convex form on the front side of the pellet and into a concave form on the rear side of the same, so that the concave portion of one package can engage with the convex portion of another package.