Company Filing History:
1 out of 42,508 
1 out of 4 Years Active: 1993
Title: The Innovative Journey of Toshio Nosaka: Pioneer in Semiconductor Technology
Introduction: Toshio Nosaka, a notable inventor hailing from Musashimurayama, Japan, has made substantial contributions to the field of semiconductor devices. With one patent to his name, he has been instrumental in advancing electronic devices, particularly in achieving higher packing density and circuit integration.
Latest Patents: Toshio Nosaka's patent, titled "Semiconductor device and an electronic device with the semiconductor," offers a groundbreaking approach to packaging. This innovative structure includes several thin, surface mount packages stacked together. Each package features a semiconductor pellet, leads attached to the front surface, a radiating plate on the rear, and a resin mold member. The design promotes stability through a unique mold member shaped into a convex form on the front side and a concave form on the rear side, allowing for efficient engagement between the stacked packages.
Career Highlights: Nosaka's career includes significant tenures at major companies such as Hitachi, Ltd. and Hitachi VLSI Engineering Corporation. His work at these leading technology firms has played a critical role in shaping the future of semiconductor technologies.
Collaborations: Throughout his career, Toshio Nosaka has had the privilege of collaborating with accomplished coworkers, including Kunihiko Nishi and Michio Tanimoto. These partnerships have enriched his professional experience and contributed to the innovations that stemmed from their collective expertise.
Conclusion: Toshio Nosaka stands out as a key figure in the world of semiconductor innovation. His pioneering patent not only showcases his inventive spirit but also underscores the critical advancements made in the field of electronic devices. As technology continues to evolve, the impact of his contributions will undoubtedly be felt in future developments.