Hitachi, Ltd.

Hitachi Vsli Engineering Corp.

Toshio Nosaka

Kunihiko Nishi

Michio Tanimoto

Hideaki Nakamura

Toshihiro Yasuhara

Katsuhiro Tabata

Isao Akima

Souichi Kunito

Yasuhiro Yoshikawa

A package is provided for achieving higher packing density and higher circuit integration of memories, in particular, a structure is provided having a plurality of thin, surface mount packages which are stacked up. Each of the laminated packages includes a semiconductor pellet, leads fixed to the front surface of the pellet, a radiating plate fixed to the rear surface of the same, and a resin mold member. To achieve a stabilized laminated structure, the mold member is shaped into a convex form on the front side of the pellet and into a concave form on the rear side of the same, so that the concave portion of one package can engage with the convex portion of another package.

Semiconductor device and an electronic device with the semiconductor

Growing community of inventors

Musashimurayama, Japan

Toshio Nosaka