The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 10, 1976
Filed:
Nov. 14, 1974
Hitachi, Ltd., , JA;
Abstract
A wire bonding system connects wires between electrode pads on a semiconductor pellet fixed on a lead frame to the corresponding lead parts on the lead frame. The lead frame with the pellet fixed thereon is first set in a position beneath a projector, to obtain a magnified image of the pellet, from which the position of the pellet is measured. On the basis of the measured value, a computer calculates positions for bonding the wires. The lead frame with the pellet therein is then set on the wire bonding machine and the positions of the bonding head are controlled using the result of said calculation to carry out wire bonding. The position measuring means is separate from the bonding machine, with an on-line or off-line connection therebetween.