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For the Inventor, By the Inventor

Hillsboro, OR, United States of America

Michael D Goodner

This inventor holds 49 USPTO granted patents and 2 EPO patents, primarily in Dielectric Materials. Top assignees: Intel Corporation, Honeywell International Inc., Sumitomo Bakelite Company Limited. Active years: 2003-2015.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Michael D Goodner. Retrieved from https://idiyas.com/inventor/michael-d-goodner

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 49

% Patents Active = 22.4


Average Co-Inventor Count = 2.5

ph-index = 13

Forward Citations = 1,327(Granted Patents)


Company Filing History:

goldMedal47 out of 56,322 
 
Intel Corporation
 patents
silverMedal2 out of 16,049 
 
Honeywell International Inc.
 patents
bronzeMedal1 out of 615 
 
Sumitomo Bakelite Company Limited
 patents
where one patent can have more than one assignee

Years Active: 2003-2015

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Areas of Expertise:
Antireflective Coatings
Dielectric Materials
Photoresist Technology
Low-k Dielectrics
Semiconductor Structures
Polymer Composites
Energy Harvesting
Porous Dielectrics
Silicon Nitride Films
Interconnect Structures
Film Formation Precursors
UV-Activated Layers
49 patents (USPTO):Explore Patents
1. 8992806 - Antireflective coatings for via fill and photolithography applications and methods of preparation thereof (2015-03-31),
2. 8513111 - Forming semiconductor structures (2013-08-20),
3. 8104172 - Method buffer coating having a physical mixture of high toughness polymer and a low shrinkage polymer (2012-01-31),
4. 8053159 - Antireflective coatings for via fill and photolithography applications and methods of preparation thereof (2011-11-08),
5. 8003293 - Pixelated photoresists (2011-08-23),
6. 7790630 - Silicon-doped carbon dielectrics (2010-09-07),
7. 7732936 - Buffer coating having a physical mixture of high toughness polymer and a low shrinkage polymer (2010-06-08),
8. 7658975 - Sealing porous dielectric materials (2010-02-09),
9. 7615337 - Photoactive resist capping layer (2009-11-10),
10. 7595555 - Method of forming air gaps in a dielectric material using a sacrificial film and resulting structures (2009-09-29),
11. 7585615 - Composite photoresist for modifying die-side bumps (2009-09-08),
12. 7572732 - Method to modulate etch rate in SLAM (2009-08-11),
13. 7563727 - Low-k dielectric layer formed from aluminosilicate precursors (2009-07-21),
14. 7560165 - Sealing porous dielectric materials (2009-07-14),
15. 7470450 - Forming a silicon nitride film (2008-12-30),

Title: The Innovative Journey of Michael D Goodner

Introduction: Michael D Goodner, a talented inventor hailing from Hillsboro, Oregon, has made significant contributions to the field of technology through his groundbreaking inventions and patents.

Latest Patents: Michael D Goodner holds several patents in various technological domains, showcasing his versatility and creativity in innovation.

Career Highlights: Throughout his illustrious career, Michael D Goodner has been at the forefront of technological advancements, consistently pushing the boundaries of innovation. His dedication to creating solutions that improve lives has earned him recognition in the industry.

Collaborations: Michael D Goodner has collaborated with leading tech companies, research institutions, and universities to bring his inventions to life. His ability to work in diverse teams and leverage collective expertise has been instrumental in the success of his projects.

Conclusion: In conclusion, Michael D Goodner's passion for innovation, coupled with his technical expertise, has established him as a prominent figure in the world of inventors. His relentless pursuit of excellence continues to inspire future generations of innovators.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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