Union City, CA, United States of America

Mehrdad Mahanpour

This inventor holds 23 USPTO granted patents, primarily in Semiconductor Packaging. Top assignee: Advanced Micro Devices Corporation. Active years: 2000-2010.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Mehrdad Mahanpour. Retrieved from https://idiyas.com/inventor/mehrdad-mahanpour

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 23

% Patents Active = 69.6

Average Co-Inventor Count = 1.8

ph-index = 5

Forward Citations = 125(Granted Patents)

Company Filing History:

23 out of 13,168

Advanced Micro Devices Corporation

patents

Years Active: 2000-2010

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Areas of Expertise:

Integrated Circuit Technology

Chip-Level Defects

Emission Imaging

Silicon On Insulator

Backside Voltage Contrast

Plasma Etch

Fault Detection

FBGA Package

Die Removal

Multi-Layer Support

Decapsulation

Polymer Build Up

23 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 7670915 - Contact liner in integrated circuit technology (2010-03-02),

2. 7093209 - Method and apparatus for packaging test integrated circuits (2006-08-15),

3. 6995564 - Method and system for locating chip-level defects through emission imaging of a semiconductor device (2006-02-07),

4. 6991946 - Method and system for providing backside voltage contrast for silicon on insulator devices (2006-01-31),

5. 6941529 - Method and system for using emission microscopy in physical verification of memory device architecture (2005-09-06),

6. 6866416 - Detecting heat generating failures in unpassivated semiconductor devices (2005-03-15),

7. 6830941 - Method and apparatus for identifying individual die during failure analysis (2004-12-14),

8. 6770512 - Method and system for using TMAH for staining copper silicon on insulator semiconductor device cross sections (2004-08-03),

9. 6770495 - Method for revealing active regions in a SOI structure for DUT backside inspection (2004-08-03),

10. 6528332 - Method and system for reducing polymer build up during plasma etch of an intermetal dielectric (2003-03-04),

11. 6485361 - Apparatus for holding and delayering a semiconductor die (2002-11-26),

12. 6452234 - How to improve the ESD on SOI devices (2002-09-17),

13. 6395129 - Process to decapsulate a FBGA package (2002-05-28),

14. 6387206 - Method and system for plastic package decapsulation of electronic devices (2002-05-14),

15. 6320400 - Method and system for selectively disconnecting a redundant power distribution network to indentify a site of a short (2001-11-20),

Title: Innovations and Contributions of Mehrdad Mahanpour in Integrated Circuit Technology

Introduction

Mehrdad Mahanpour is a prominent inventor based in Union City, California, renowned for his contributions to the field of integrated circuit technology. With an impressive portfolio of 23 patents, he has significantly influenced advancements in semiconductor design and manufacturing processes.

Latest Patents

Among his notable innovations, Mehrdad's latest patents include a method of forming an integrated circuit with a semiconductor substrate. This involves the formation of a gate dielectric, followed by the creation of a gate, source/drain junctions, and a silicide on the junctions and gate. His innovative approach utilizes contact liners in the contact holes to enhance circuit performance while maintaining a thermal budget conducive to the silicide. Additionally, Mehrdad has developed a method and apparatus for packaging test integrated circuits. This system allows for effective partitioning of a system IC into test ICs, optimizing testing efficiency and functionality.

Career Highlights

Mehrdad Mahanpour is currently affiliated with Advanced Micro Devices Corporation, where he applies his extensive knowledge in integrated circuit technologies. His work focuses on the enhancement of semiconductor devices, addressing both functionality and performance characteristics. Throughout his career, he has consistently been at the forefront of semiconductor innovations, contributing to numerous advancements and efficiencies in integrated circuits.

Collaborations

In his professional journey, Mehrdad has collaborated with notable colleagues such as Mohammad Massoodi and Jose Hulog. These partnerships have facilitated knowledge sharing and innovation, leading to the development of cutting-edge technologies that benefit the industry as a whole.

Conclusion

Overall, Mehrdad Mahanpour's contributions to the field of integrated circuit technology exemplify the power of innovation in the semiconductor industry. His patents not only demonstrate his expertise as an inventor but also highlight the significant impact that dedicated professionals can have on technological advancements. As he continues his work at Advanced Micro Devices Corporation, the future of integrated circuit technology is likely to be further shaped by his inventive spirit.

Profile summary based on public USPTO records.

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]