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For the Inventor, By the Inventor

Yoshikawa, Japan

Masayuki Nishiwaki

USPTO Granted Patents = 15 

Average Co-Inventor Count = 1.8

ph-index = 5

Forward Citations = 115(Granted Patents)


Location History:

  • Kawasaki, JP (1993 - 1998)
  • Kawaguchi, JP (1998 - 1999)
  • Soka, JP (2000 - 2001)
  • Yoshikawa, JP (2003 - 2012)

Company Filing History:

goldMedal15 out of 90,631 
 
Canon Kabushiki Kaisha
 patents

Years Active: 1993-2012

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15 patents (USPTO):Explore Patents
1. 8108998 - Laser cutting method (2012-02-07),
2. 8093530 - Laser cutting apparatus and laser cutting method (2012-01-10),
3. 7807940 - Laser processing apparatus and laser processing method (2010-10-05),
4. 7791001 - Automatic focusing apparatus, laser processing apparatus, and laser cutting apparatus (2010-09-07),
5. 7211526 - Laser based splitting method, object to be split, and semiconductor element chip (2007-05-01),
6. 6515694 - Illumination device and optical processing apparatus using the same (2003-02-04),
7. 6239914 - Method of manufacturing nozzle member, and work apparatus (2001-05-29),
8. 6218081 - Method of manufacturing nozzle member, and work apparatus (2001-04-17),
9. 6114654 - Split-beam laser apparatus for making a nozzle member (2000-09-05),
10. 5946024 - Illuminating apparatus and device manufacturing method (1999-08-31),
11. 5841101 - Method used in manufacturing a workpiece using a plurality of spaced (1998-11-24),
12. 5828496 - Illumination optical system (1998-10-27),
13. 5517000 - Apparatus for forming a workpiece using plural light beams (1996-05-14),
14. 5389954 - Laser process apparatus for forming holes in a workpiece (1995-02-14),
15. 5263250 - Method of manufacturing nozzle plate for ink jet printer (1993-11-23),

Title: Masayuki Nishiwaki: Innovator in Laser Cutting Technology

Introduction

Masayuki Nishiwaki is a prominent inventor based in Yoshikawa, Japan. He has made significant contributions to the field of laser cutting technology, holding a total of 15 patents. His innovative approaches have advanced the capabilities of laser applications in various industries.

Latest Patents

Nishiwaki's latest patents include a laser cutting method that focuses on condensing a laser beam at internal points within a substrate. This method creates processing regions while sweeping the laser along a cutting line associated with a recess on the substrate. Additionally, he has developed a laser cutting apparatus that concentrates laser light into a silicon substrate, producing multiple internal cracks. This technology allows for precise control over the lengths of the cracks, ensuring that they lead to a predetermined cutting line on the substrate's surface.

Career Highlights

Masayuki Nishiwaki is currently employed at Canon Kabushiki Kaisha, where he continues to innovate in the field of laser technology. His work has not only enhanced the efficiency of laser cutting processes but has also paved the way for new applications in various sectors.

Collaborations

Throughout his career, Nishiwaki has collaborated with notable colleagues, including Junichiro Iri and Genji Inada. These partnerships have contributed to the development of cutting-edge technologies and have fostered a collaborative environment for innovation.

Conclusion

Masayuki Nishiwaki's contributions to laser cutting technology exemplify the impact of innovative thinking in engineering. His patents and ongoing work at Canon Kabushiki Kaisha continue to shape the future of laser applications.

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