The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 10, 2012
Filed:
Nov. 15, 2005
Masayuki Nishiwaki, Yoshikawa, JP;
Junichiro Iri, Yokohama, JP;
Genji Inada, Kawasaki, JP;
Sadayuki Sugama, Tsukuba, JP;
Masayuki Nishiwaki, Yoshikawa, JP;
Junichiro Iri, Yokohama, JP;
Genji Inada, Kawasaki, JP;
Sadayuki Sugama, Tsukuba, JP;
Canon Kabushiki Kaisha, Tokyo, JP;
Abstract
A laser cutting apparatus and a laser cutting method are provided which are adapted to concentrate laser light into a silicon substrate to produce a plurality of internal cracks. A light concentrating position, to which laser beams included in the laser light are concentrated, is temporally and spatially displaced to appropriately change lengths of the cracks according to positions in a direction of depth of the substrate. Consequently, the lengths of the internal cracks are controlled to surely lead a crack opening, the starting point of which is the internal crack formed by laser processing, to a predetermined cutting line on a surface of the substrate.