The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 01, 2007

Filed:

Feb. 16, 2005
Applicants:

Junichiro Iri, Kawasaki, JP;

Genji Inada, Kawasaki, JP;

Sadayuki Sugama, Tsukuba, JP;

Masayuki Nishiwaki, Yoshikawa, JP;

Hiroyuki Morimoto, Tsukuba, JP;

Inventors:

Junichiro Iri, Kawasaki, JP;

Genji Inada, Kawasaki, JP;

Sadayuki Sugama, Tsukuba, JP;

Masayuki Nishiwaki, Yoshikawa, JP;

Hiroyuki Morimoto, Tsukuba, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/36 (2006.01);
U.S. Cl.
CPC ...
Abstract

A laser splitting method for splitting off a segment from an object to be split using a laser beam, includes a surface processing step of processing the object by forming a linear recessed portion in a surface of the object, the linear recessed portion being effective to cause a stress concentration at the surface of the object; an internal processed-region forming step of forming an internal processed-regions at a depth of the object in a line along which a laser beam scans the surface of the object by a relative motion therebetween, the laser beam being converged adjacent the depth, wherein the thus formed internal processed-regions extend in a direction substantially perpendicular to the surface of the object; and an external force applying step of applying an external force to the object to form cracks between the recessed portion and the internal processed-regions.


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