Nagano, Japan

Masatoshi Akagawa

This inventor holds 28 USPTO granted patents and 1 published patent application, primarily in Semiconductor Manufacturing. Top assignees: Shinko Electric Industries Co., Ltd., Fujitsu Corporation, Hitachi, Ltd.. Active years: 1995-2011.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Masatoshi Akagawa. Retrieved from https://idiyas.com/inventor/masatoshi-akagawa

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 28 

% Patents Active = 82.1

Average Co-Inventor Count = 1.7

ph-index = 13

Forward Citations = 867(Granted Patents)


Location History:

  • Oaza Kurita, Nagano-shi, Nagano JP (2002)
  • Nagano, JP (1995 - 2011)

Company Filing History:


Years Active: 1995-2011

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Areas of Expertise:
Wiring Forming
Component-Embedded Board
Patterning Method
Exposing Apparatus
Maskless Exposure
Semiconductor Device
IC Card
Anisotropic Conductive Sheet
Chip Sized Device
Printed Circuit Board
Fabrication Method
Electronic Part Mounting
28 patents (USPTO):Explore Patents

Title: Innovations by Masatoshi Akagawa: Pioneering Wiring Formation Technologies

Introduction

Masatoshi Akagawa, an accomplished inventor based in Nagano, Japan, has made significant contributions to the field of electronics and wiring technologies. With 28 patents to his name, his innovations continue to impact industries reliant on advanced wiring board fabrication techniques.

Latest Patents

Among his most recent patents are a wiring forming system and a wiring forming method designed to enhance the production of wiring on boards. The wiring forming system includes a maskless exposure unit that directly exposes an unexposed board using data generated from design specifications. Additionally, a post-development inspect unit tests the board post-exposure, ensuring quality through exposure and image data. An etching unit follows this, carefully etching the developed board, while a post-etching inspect unit evaluates the created patterns against design data, significantly improving the efficiency and accuracy of wiring formation processes.

Another notable invention is the component-embedded board fabrication method, which focuses on detecting the actual position of electronic components prior to covering the board with an insulating layer. This method involves calculating displacement data to correct design data for subsequent processing, thus ensuring precision in component placement and performance in electronic devices.

Career Highlights

Masatoshi Akagawa has worked with distinguished companies, including Shinko Electric Industries Co., Ltd. His experience in these organizations has fueled his innovative endeavors, allowing him to transform complex challenges into practical solutions in wiring and board fabrication.

Collaborations

Throughout his career, Akagawa has collaborated with notable colleagues such as Kazunari Sekigawa and Mitsutoshi Higashi. These professional relationships have fostered a dynamic exchange of ideas and have contributed to the advancement of technologies in the field.

Conclusion

Masatoshi Akagawa stands out as a leading innovator in wiring technology, with a robust portfolio of patents that underline his expertise and commitment to advancing the field. His latest inventions are not only testament to his innovative spirit but also exemplify the crucial role that precision and technology play in modern electronics manufacturing.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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