The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 05, 2006
Filed:
Apr. 21, 2004
Tadatomo Suga, Tokyo 164-0003, JP;
Toshihiro Itoh, Tokyo, JP;
Hideto Nakazawa, Nagano, JP;
Masatoshi Akagawa, Nagano, JP;
Tadatomo Suga, Tokyo 164-0003, JP;
Toshihiro Itoh, Tokyo, JP;
Hideto Nakazawa, Nagano, JP;
Masatoshi Akagawa, Nagano, JP;
Other;
Shinko Electric Industries Co., Ltd., Nagano, JP;
Oki Electric Industry Co., Ltd., Tokyo, JP;
Sanyo Electric Co., Ltd., Osaka, JP;
Sharp Kabushiki Kaisha, Osaka, JP;
Sony Corporation, Tokyo, JP;
Kabushiki Kaisha Toshiba, Tokyo, JP;
NEC Corporation, Tokyo, JP;
Hitachi, Ltd., Tokyo, JP;
Fujitsu Limited, Kawasaki, JP;
Matsushita Electric Industrial Co., Ltd., Osaka, JP;
Mitsubishi Denki Kabushiki Kaisha, Tokyo, JP;
Rohm Co., LTD, Kyoto, JP;
Abstract
A method of mounting an electronic part on a board, in which an electronic part and a mounting board on which the electronic part is to be mounted are placed in a vacuum or inert atmosphere, and the electronic part is mounted on the board by bringing the bonding members of the electronic part and the board into contact with each other at normal temperature to thereby mount the electronic part on the board, the method comprising forming the bonding members of at least one of the electronic part and the board out of a solder material, and bringing the bonding members of the electronic part and the board into contact with each other without preprocessing the bonding surfaces of the bonding members.