The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 06, 2004
Filed:
May. 31, 2002
Masatoshi Akagawa, Nagano, JP;
Shinko Electric Industries Co., Ltd., Nagano, JP;
Abstract
An object of the present invention is to make it possible to effect a reliable and compact configuration for a semiconductor device when mounting a plurality of semiconductor elements in a single package, and achieve higher integration and higher functionality more effectively. In a multi-layer wiring board in which wiring patterns (conductor layers) , and , and insulating layers , and , are formed alternately in multiple layers on a base substrate, and electrically connections are made between the wiring patterns through via holes VH and VH , semiconductor elements are imbedded and mounted inside the insulating layers , and , and the semiconductor elements are deployed so that they are electrically connected to wiring patterns that are covered by the insulating layers, and so that they are stacked up in a direction perpendicular to the planar dimension of the multi-layer wiring board
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile