The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 08, 2003
Filed:
Jan. 25, 2001
Applicant:
Inventor:
Masatoshi Akagawa, Nagano, JP;
Assignee:
Shinko Electric Industries Co., Ltd., Nagano, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/348 ; H01L 2/352 ; H01L 2/940 ;
U.S. Cl.
CPC ...
H01L 2/348 ; H01L 2/352 ; H01L 2/940 ;
Abstract
Semiconductor chips having a thickness of 50 &mgr;m or so are imbedded and mounted inside a package, such that multi-level stacking is facilitated by providing external connection terminals on both surfaces of the package, or, alternatively, exposing the terminal formation portions of the wiring pattern, to which the external connection terminals are to be connected, out of a solder resist layer.
Akagawa, Masatoshi. (2003). Semiconductor device and manufacturing method therefor (U.S. Patent No. 6590291). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6590291
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile