The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 14, 2010
Filed:
Jul. 03, 2003
Applicants:
Masatoshi Akagawa, Nagano, JP;
Kazunari Sekigawa, Nagano, JP;
Shinichi Wakabayashi, Nagano, JP;
Inventors:
Assignee:
Shinko Electric Industries Co., Ltd., Nagano, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/30 (2006.01);
U.S. Cl.
CPC ...
Abstract
A component-embedded board fabrication method includes detecting, before the board is covered with a first insulating layer, the actual position of a first electronic component formed on a surface of the board, calculating a displacement between the design position of the first electronic component on the surface of the board and holding the displacement as first displacement data, and correcting, based on the first displacement data, design data to be used for processing the board after the board is covered with the first insulating layer.