Nagano, Japan

Shinichi Wakabayashi

This inventor holds 21 USPTO granted patents, primarily in Semiconductor Packaging. Top assignee: Shinko Electric Industries Co., Ltd.. Active years: 1981-2011.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Shinichi Wakabayashi. Retrieved from https://idiyas.com/inventor/shinichi-wakabayashi

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 90.5

Average Co-Inventor Count = 2.7

ph-index = 9

Forward Citations = 517(Granted Patents)


Location History:

  • Samizumura, JP (1981)
  • Nagano, JP (1986 - 2011)

Company Filing History:


Years Active: 1981-2011

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Areas of Expertise:
Wiring Forming
Component-Embedded Board
Interposer
Electroplating Solution
Lead Frame
Semiconductor Device
Circuit Board
Tape Automated Bonding
Ceramic Package
Electroless Plating
Gold Plating
Silver Plating
21 patents (USPTO):Explore Patents

Title: Innovator Shinichi Wakabayashi: Pioneering the Future of Wiring Technologies

Introduction: Shinichi Wakabayashi, based in Nagano, Japan, is a distinguished inventor with an impressive portfolio of 21 patents. His work focuses on innovative wiring technologies that are transforming the landscape of electronic component integration. As a key member of Shinko Electric Industries Co., Ltd., Wakabayashi continues to push the boundaries of electronic design and manufacturing.

Latest Patents: Among his most recent contributions to the field are two notable patents:

1. **Wiring Forming System and Wiring Forming Method** - This innovative system includes a maskless exposure unit that directly exposes an unexposed board using exposure data derived from design data related to the wiring board. It incorporates a post-development inspection unit that tests the board post-development, employing both exposure data and image data from the board's exposure. The etching unit follows, etching the developed board, while a post-etching inspection unit ensures quality by testing the formed etching pattern against the design data and inspects data.

2. **Component-Embedded Board Fabrication Method** - This method involves detecting the actual position of a first electronic component before the board is covered with the first insulating layer. It calculates the displacement between the design position of the component and retains this as first displacement data. Subsequently, design data is corrected based on this information to enhance the accuracy of processing the board after the insulating layer application.

Career Highlights: As an inventor at Shinko Electric Industries Co., Ltd., Wakabayashi has played a pivotal role in developing advanced technologies that enhance the fabrication and functionality of wiring boards. His contributions are significant in ensuring high precision in electronic component placement, which is vital for modern electronics.

Collaborations: Throughout his career, Wakabayashi has collaborated with notable coworkers, including Masao Nakazawa and Katsuya Fukase. Their combined expertise fosters a creative environment that drives impactful innovations in the field.

Conclusion: Shinichi Wakabayashi stands as a prominent figure in the realm of electronic innovations. His extensive patent portfolio reflects his commitment to advancing technology and improving the efficiency of electronic manufacturing processes. As he continues to develop new methodologies, the influence of his work will undoubtedly shape the future of the industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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