The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 24, 1995
Filed:
Dec. 14, 1993
Kazuhito Yumoto, Nagano, JP;
Norio Wakabayashi, Nagano, JP;
Masao Nakazawa, Nagano, JP;
Shinichi Wakabayashi, Nagano, JP;
Norio Wada, Nagano, JP;
Fumio Kuraishi, Nagano, JP;
Toshihiko Shimada, Nagano, JP;
Shinko Electric Industries Co. Ltd., Nagano, JP;
Abstract
A tape useful for an automatic bonding process when manufacturing a high-frequency semiconductor device, the tape comprising an insulating flexible film, and circuit patterns consisting of copper or copper-alloy formed on the insulating film, each of the circuit patterns having inner and an outer lead portions. A tin or tin-lead plated film is formed on the pattern, and an intermediate plated film is formed on at least the outer lead portion as an underlayer. The intermediate plated film consists of a metal or metal alloy selected from nickel, cobalt, gold, silver, platinum, palladium, indium or rhodium.