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For the Inventor, By the Inventor

Tokyo, Japan

Masami Aoyama

This inventor holds 10 USPTO granted patents and 9 published patent applications and 5 EPO patents. Top assignee: The Furukawa Electric Co., Ltd.. Active years: 2016-2020.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Masami Aoyama. Retrieved from https://idiyas.com/inventor/masami-aoyama

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 10 

% Patents Active = 90.0

 

Average Co-Inventor Count = 2.6

ph-index = 1

Forward Citations = 2(Granted Patents)


Company Filing History:

goldMedal10 out of 2,643 
 
The Furukawa Electric Co., Ltd.
 patents

Years Active: 2016-2020

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10 patents (USPTO):Explore Patents
1. 10699933 - Wafer-fixing tape, method of processing a semiconductor wafer, and semiconductor chip (2020-06-30),
2. 10563096 - Conductive adhesive composition (2020-02-18),
3. 10418267 - Method of processing a semiconductor wafer, semiconductor chip, and surface protective tape (2019-09-17),
4. 10196547 - Resin composition for sealing electronic device, and electronic device (2019-02-05),
5. 10196534 - Resin composition for sealing electronic device, and electronic device (2019-02-05),
6. 10115707 - Adhesive film and semiconductor package using adhesive film (2018-10-30),
7. 10043996 - Resin composition for element encapsulation for organic electronic devices, resin sheet for element encapsulation for organic electronic devices, organic electroluminescent element, and image display device (2018-08-07),
8. 9758690 - Transparent resin composition for sealing organic electroluminescence element, resin sheet for sealing organic electroluminescence element, and apparatus for displaying image (2017-09-12),
9. 9631123 - Adhesive sheet (2017-04-25),
10. 9523023 - Adhesive sheet (2016-12-20),

Title: Masami Aoyama: Innovator in Semiconductor Technology

Introduction

Masami Aoyama is a prominent inventor based in Tokyo, Japan. He has made significant contributions to the field of semiconductor technology, holding a total of 10 patents. His innovative work focuses on improving the efficiency and safety of semiconductor manufacturing processes.

Latest Patents

Aoyama's latest patents include a wafer-fixing tape designed for semiconductor wafers. This tape features a temporary-adhesive layer on a substrate film made from an ionomer resin that is crosslinked by a metal ion. The surface of the substrate film has an arithmetic average roughness Ra ranging from 0.1 to 3.0 µm. Another notable patent is a conductive adhesive composition that is free from toxic substances like lead. This composition includes a thermosetting resin, a metal-containing filler, and a catalyst or curing agent, with a reaction initiation temperature of 180°C or higher.

Career Highlights

Masami Aoyama is currently employed at The Furukawa Electric Co., Ltd., where he continues to develop innovative solutions in semiconductor technology. His work has been instrumental in advancing the capabilities of semiconductor manufacturing.

Collaborations

Aoyama collaborates with talented individuals such as Takumi Asanuma and Tetsuya Mieda, contributing to a dynamic and innovative work environment.

Conclusion

Masami Aoyama's contributions to semiconductor technology through his patents and collaborations highlight his role as a leading inventor in the field. His innovative solutions continue to shape the future of semiconductor manufacturing.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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