The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 07, 2018
Filed:
Sep. 28, 2015
Furukawa Electric Co., Ltd., Tokyo, JP;
Masami Aoyama, Tokyo, JP;
Tetsuya Mieda, Tokyo, JP;
Keiji Saito, Tokyo, JP;
Kunihiko Ishiguro, Tokyo, JP;
Toshimitsu Nakamura, Tokyo, JP;
Naoaki Mihara, Tokyo, JP;
Takumi Asanuma, Tokyo, JP;
FURUKAWA ELECTRIC CO., LTD., Tokyo, JP;
Abstract
Provided are a resin composition for element encapsulation for organic electronic devices which is transparent, has excellent flexibility, water vapor barrier properties, and adhesive force, and can suppress the generation of dark spots, a resin sheet for element encapsulation for organic electronic devices, an organic electroluminescent element, and an image display device. This adhesive resin composition for element encapsulation for organic electronic devices is used to seal an element for organic electronic devices, and is characterized by containing a diene polymer and a softening agent, in which the content of the softening agent is from 5% by mass to 30% by mass of the total mass.