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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10115707 B1

PDFFull Text
Date of Patent:
Oct. 30, 2018

Filed:

Feb. 09, 2017

Adhesive film and semiconductor package using adhesive film

Applicant:

Furukawa Electric Co., Ltd., Tokyo, JP;

Inventors:

Noriyuki Kirikae, Tokyo, JP;

Masami Aoyama, Tokyo, JP;

Assignee:

FURUKAWA ELECTRIC CO., LTD., Tokyo, JP;

Attorney:

Oliff PLC

Primary Examiner:

Michelle Mandala

Int. Cl.
CPC ...
H01L 25/065 (2006.01); C09J 4/00 (2006.01); C09J 7/00 (2018.01); C09J 11/06 (2006.01); H01L 21/52 (2006.01); H01L 23/00 (2006.01); C09J 7/02 (2006.01); C09J 11/04 (2006.01); C09J 179/08 (2006.01); H01L 21/683 (2006.01); C09J 7/20 (2018.01); C09J 7/30 (2018.01); C09J 7/25 (2018.01);
U.S. Cl.
CPC ...
H01L 25/0657 (2013.01); C09J 4/00 (2013.01); C09J 7/00 (2013.01); C09J 7/0285 (2013.01); C09J 7/20 (2018.01); C09J 7/255 (2018.01); C09J 7/30 (2018.01); C09J 11/04 (2013.01); C09J 11/06 (2013.01); C09J 179/085 (2013.01); H01L 21/52 (2013.01); H01L 21/6836 (2013.01); H01L 24/27 (2013.01); H01L 24/32 (2013.01); H01L 24/48 (2013.01); H01L 24/83 (2013.01); H01L 2224/3224 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/8385 (2013.01); H01L 2224/83191 (2013.01); H01L 2224/92247 (2013.01); H01L 2225/0651 (2013.01); H01L 2225/06555 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/181 (2013.01); H05K 999/99 (2013.01);
Abstract

An adhesive film that can solve the problem of pickup defect and improve the yield rate of semiconductor packages. The adhesive film includes: (A) a bismaleimide resin; (B) a radical initiator; and (C) a coupling agent that contains a (meth)acrylic group. Further, an adhesive film with dicing tape, which includes such an adhesive film laminated onto a dicing tape, is provided. Furthermore, a semiconductor package that includes such an adhesive film with dicing tape is provided.

Find Patent Forward Citations

Kirikae, Noriyuki. (2018). Adhesive film and semiconductor package using adhesive film (U.S. Patent No. 10115707). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10115707

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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