Company Filing History:
Years Active: 2018-2022
Title: Noriyuki Kirikae: Innovator in Electrically Conductive Adhesive Films
Introduction
Noriyuki Kirikae is a prominent inventor based in Tokyo, Japan. He has made significant contributions to the field of electrically conductive adhesive films, holding a total of 8 patents. His innovative work has implications for various applications in electronics and materials science.
Latest Patents
Kirikae's latest patents include advancements in electrically conductive adhesive films and dicing-die bonding films. One of his notable inventions involves an electrically conductive adhesive film that comprises a metal particle, a resin, and at least one of a prescribed organic phosphine and a prescribed sulfide-based compound. The resin utilized in this film is a thermosetting resin, which has a storage elastic modulus at 1 Hz measured in a state after sintering of 20 GPa or less. Additionally, it exhibits a thermal weight loss ratio of less than 1% when heated for 2 hours at 250°C under a nitrogen atmosphere. Another patent focuses on an electrically conductive adhesive film that includes a metal particle with an average particle size of 20 µm or less, comprising 10% by mass or more of a first metal particle having a fractal dimension of 1.1 or more when viewed in a projection drawing in a primary particle state.
Career Highlights
Kirikae is associated with The Furukawa Electric Co., Ltd., where he has been instrumental in developing cutting-edge materials. His work has not only advanced the company's product offerings but has also contributed to the broader field of conductive materials.
Collaborations
Throughout his career, Kirikae has collaborated with notable colleagues, including Naoaki Mihara and Jirou Sugiyama. These collaborations have fostered innovation and have led to the successful development of new technologies in their field.
Conclusion
Noriyuki Kirikae's contributions to the field of electrically conductive adhesive films highlight his role as a leading inventor in Japan. His patents reflect a commitment to innovation and excellence in materials science.