The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 18, 2020

Filed:

Feb. 09, 2017
Applicant:

Furukawa Electric Co., Ltd., Tokyo, JP;

Inventors:

Masami Aoyama, Tokyo, JP;

Noriyuki Kirikae, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C09J 9/02 (2006.01); C09J 11/06 (2006.01); H01L 21/52 (2006.01); C09J 179/08 (2006.01); H01L 21/683 (2006.01); H01L 21/78 (2006.01);
U.S. Cl.
CPC ...
C09J 9/02 (2013.01); C09J 11/06 (2013.01); C09J 179/085 (2013.01); H01L 21/52 (2013.01); H01L 21/6836 (2013.01); H01L 21/78 (2013.01); C09J 2201/602 (2013.01); C09J 2203/326 (2013.01); C09J 2400/163 (2013.01); C09J 2479/08 (2013.01);
Abstract

A conductive adhesive that does not contain toxic substances such as solder (lead) and shows excellent adhesiveness. Specifically, it is a conductive adhesive composition, which includes: (A) a thermosetting resin; (C) a filler that contains a metal element; and (D) at least one catalyst or curing agent, wherein the reaction initiation temperature for the (A) thermosetting resin and the (D) at least one catalyst or curing agent is 180° C. or higher. More preferably, the reaction initiation temperature is 200° C. or higher. More preferably, it is a conductive adhesive composition that further includes (B) a flux and (E) a polymer component.


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