The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 23, 2020

Filed:

Aug. 21, 2017
Applicant:

Furukawa Electric Co., Ltd., Tokyo, JP;

Inventors:

Naoaki Mihara, Tokyo, JP;

Noriyuki Kirikae, Tokyo, JP;

Jirou Sugiyama, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09J 9/02 (2006.01); C09J 163/00 (2006.01); H01B 1/22 (2006.01); C08G 73/10 (2006.01); C09J 7/35 (2018.01); C09J 11/02 (2006.01); H01L 23/00 (2006.01); C08G 73/12 (2006.01); C09J 7/10 (2018.01); C09J 201/00 (2006.01); C09J 179/08 (2006.01); H01L 21/52 (2006.01); C09J 11/04 (2006.01); C09J 11/06 (2006.01); C08K 3/10 (2018.01); H01L 21/683 (2006.01); C08K 5/372 (2006.01); C08K 3/08 (2006.01); C08K 5/375 (2006.01); C08K 5/45 (2006.01);
U.S. Cl.
CPC ...
C09J 9/02 (2013.01); C08G 73/1082 (2013.01); C08G 73/128 (2013.01); C08K 3/10 (2013.01); C09J 7/10 (2018.01); C09J 7/35 (2018.01); C09J 11/02 (2013.01); C09J 11/04 (2013.01); C09J 11/06 (2013.01); C09J 163/00 (2013.01); C09J 179/08 (2013.01); C09J 179/085 (2013.01); C09J 201/00 (2013.01); H01B 1/22 (2013.01); H01L 21/52 (2013.01); H01L 21/6836 (2013.01); H01L 24/27 (2013.01); H01L 24/29 (2013.01); H01L 24/83 (2013.01); C08K 3/08 (2013.01); C08K 5/372 (2013.01); C08K 5/375 (2013.01); C08K 5/45 (2013.01); C08K 2003/085 (2013.01); C08K 2003/0862 (2013.01); C08K 2201/001 (2013.01); C09J 2203/326 (2013.01); C09J 2205/102 (2013.01); C09J 2463/00 (2013.01); C09J 2479/08 (2013.01); H01L 24/05 (2013.01); H01L 24/45 (2013.01); H01L 24/48 (2013.01); H01L 24/73 (2013.01); H01L 24/92 (2013.01); H01L 2221/6839 (2013.01); H01L 2221/68327 (2013.01); H01L 2221/68381 (2013.01); H01L 2224/04026 (2013.01); H01L 2224/05644 (2013.01); H01L 2224/27436 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/2929 (2013.01); H01L 2224/29209 (2013.01); H01L 2224/29211 (2013.01); H01L 2224/29218 (2013.01); H01L 2224/29224 (2013.01); H01L 2224/29239 (2013.01); H01L 2224/29244 (2013.01); H01L 2224/29247 (2013.01); H01L 2224/29255 (2013.01); H01L 2224/29266 (2013.01); H01L 2224/29309 (2013.01); H01L 2224/29311 (2013.01); H01L 2224/29318 (2013.01); H01L 2224/29324 (2013.01); H01L 2224/29339 (2013.01); H01L 2224/29344 (2013.01); H01L 2224/29347 (2013.01); H01L 2224/29355 (2013.01); H01L 2224/29366 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/45124 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/8384 (2013.01); H01L 2224/83191 (2013.01); H01L 2224/83851 (2013.01); H01L 2224/83855 (2013.01); H01L 2224/83906 (2013.01); H01L 2224/92247 (2013.01); H01L 2924/0665 (2013.01); H01L 2924/0705 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/181 (2013.01);
Abstract

A composition exhibits excellent heat resistance and mounting reliability when bonding a semiconductor power element to a metal lead frame, which is also free of lead and thereby places little burden on the environment. An electrically conductive composition contains at least a sulfide compound represented by R—S—R' (wherein R is an organic group containing at least carbon; R′ is an organic group that is the same as or different from R; and R and R′ may be bonded to each other to form a so-called cyclic sulfide) and metal particles containing at least Cu, Sn or Ni as its essential component. Further, a conductive paste and a conductive bonding film each are produced using the electrically conductive composition. A dicing die bonding film is obtained by bonding the conductive bonding film with an adhesive tape.


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