Tokyo, Japan

Jirou Sugiyama

USPTO Granted Patents = 6 

 

Average Co-Inventor Count = 3.0

ph-index = 1

Forward Citations = 7(Granted Patents)


Company Filing History:


Years Active: 2020-2022

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6 patents (USPTO):Explore Patents

Title: Jirou Sugiyama: Innovator in Electrically Conductive Adhesives

Introduction

Jirou Sugiyama is a prominent inventor based in Tokyo, Japan. He has made significant contributions to the field of electrically conductive adhesives, holding a total of 6 patents. His innovative work has advanced the technology used in various applications, particularly in electronics.

Latest Patents

Among his latest patents are the "Electrically Conductive Adhesive Agent Composition" and the "Electrically Conductive Adhesive Film and Dicing-Die-Bonding Film Using the Same." The electrically conductive adhesive agent composition comprises a metal particle (Q) and a prescribed organophosphorus compound (A). The metal particle (Q) includes a first metal particle (Q1) made of a single metal selected from the group of copper, nickel, aluminum, and tin, or an alloy comprising two or more metals from this group. The electrically conductive adhesive film consists of a metal particle (Q), a resin (M), and at least one of a prescribed organic phosphine (A) and a prescribed sulfide-based compound (B). The resin (M) is a thermosetting resin (M1) and has a storage elastic modulus at 1 Hz measured in a state after sintering of 20 GPa or less, along with a thermal weight loss ratio when heated for 2 hours at 250°C under a nitrogen atmosphere of less than 1%.

Career Highlights

Jirou Sugiyama is currently employed at Furukawa Electric Co., Ltd., where he continues to develop innovative adhesive technologies. His work has been instrumental in enhancing the performance and reliability of electronic components.

Collaborations

He collaborates with notable colleagues, including Naoaki Mihara and Noriyuki Kirikae, contributing to a dynamic research environment that fosters innovation.

Conclusion

Jirou Sugiyama's contributions to the field of electrically conductive adhesives exemplify his commitment to innovation and excellence. His patents reflect a deep understanding of materials science and engineering, paving the way for advancements in electronic applications.

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