The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 19, 2022

Filed:

Aug. 07, 2018
Applicant:

Furukawa Electric Co., Ltd., Tokyo, JP;

Inventors:

Shunichiro Sato, Tokyo, JP;

Naoaki Mihara, Tokyo, JP;

Jirou Sugiyama, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C09J 9/02 (2006.01); C09J 11/06 (2006.01); C09J 7/35 (2018.01); H01L 21/683 (2006.01); H01L 23/00 (2006.01); H01B 1/22 (2006.01); C09J 179/08 (2006.01); C09J 163/00 (2006.01); C09J 157/12 (2006.01); C09J 7/10 (2018.01); C09J 11/02 (2006.01); C09J 201/00 (2006.01); C08K 3/08 (2006.01); C08K 5/50 (2006.01); H01L 21/78 (2006.01);
U.S. Cl.
CPC ...
C09J 9/02 (2013.01); C09J 7/10 (2018.01); C09J 7/35 (2018.01); C09J 11/02 (2013.01); C09J 11/06 (2013.01); C09J 157/12 (2013.01); C09J 163/00 (2013.01); C09J 179/08 (2013.01); C09J 201/00 (2013.01); H01B 1/22 (2013.01); H01L 21/6836 (2013.01); H01L 24/29 (2013.01); C08K 3/08 (2013.01); C08K 5/50 (2013.01); C09J 2203/326 (2013.01); C09J 2301/304 (2020.08); C09J 2301/314 (2020.08); C09J 2301/408 (2020.08); C09J 2400/16 (2013.01); C09J 2461/00 (2013.01); C09J 2463/00 (2013.01); C09J 2479/08 (2013.01); H01L 21/78 (2013.01); H01L 24/73 (2013.01); H01L 24/83 (2013.01); H01L 24/92 (2013.01); H01L 2224/2929 (2013.01); H01L 2224/29311 (2013.01); H01L 2224/29324 (2013.01); H01L 2224/29347 (2013.01); H01L 2224/29355 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/48465 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/83191 (2013.01); H01L 2224/92247 (2013.01); H01L 2924/181 (2013.01);
Abstract

The electrically conductive adhesive agent composition comprises a metal particle (Q) and a prescribed organophosphorus compound (A), and the metal particle (Q) comprises a first metal particle (Q1) made of a single metal selected from the group of copper, nickel, aluminum and tin or an alloy comprising two or more metals selected from said group.


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