The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 07, 2021
Filed:
Aug. 07, 2018
Applicant:
Furukawa Electric Co., Ltd., Tokyo, JP;
Inventors:
Assignee:
Furukawa Electric Co., Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09J 9/02 (2006.01); C09J 7/30 (2018.01); C09J 7/10 (2018.01); C09J 11/04 (2006.01); C09J 157/12 (2006.01); C09J 179/08 (2006.01); H01B 1/00 (2006.01); H01B 1/22 (2006.01); H01L 21/683 (2006.01); C08K 5/50 (2006.01); C09J 201/00 (2006.01); C09J 11/02 (2006.01); H01L 23/00 (2006.01); C08K 3/08 (2006.01);
U.S. Cl.
CPC ...
C09J 9/02 (2013.01); C09J 7/10 (2018.01); C09J 7/30 (2018.01); C09J 11/02 (2013.01); C09J 11/04 (2013.01); C09J 157/12 (2013.01); C09J 179/08 (2013.01); C09J 201/00 (2013.01); H01B 1/00 (2013.01); H01B 1/22 (2013.01); H01L 21/6836 (2013.01); H01L 24/29 (2013.01); C08K 3/08 (2013.01); C08K 5/50 (2013.01); C09J 2203/326 (2013.01); C09J 2301/304 (2020.08); C09J 2301/314 (2020.08); C09J 2301/408 (2020.08); C09J 2461/00 (2013.01); C09J 2463/00 (2013.01); C09J 2479/08 (2013.01); H01L 24/48 (2013.01); H01L 24/73 (2013.01); H01L 24/83 (2013.01); H01L 24/92 (2013.01); H01L 2224/2929 (2013.01); H01L 2224/29311 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/83191 (2013.01); H01L 2224/92247 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/181 (2013.01);
Abstract
The electrically conductive adhesive film comprises a metal particle (Q), a resin (M), and a prescribed organophosphorus compound (A), the resin (M) comprises a thermosetting resin (M1), and the metal particle (Q) has an average particle size (d50) of 20 μm or less and comprise 10% by mass or more of a first metal particle (Q1) having a fractal dimension of 1.1 or more when viewed in a projection drawing in a primary particle state.