The Furukawa Electric Co., Ltd.

Noriyuki Kirikae

Naoaki Mihara

Jirou Sugiyama

Masami Aoyama

Minoru Morita

The electrically conductive adhesive film comprises a metal particle (Q), a resin (M), and at least one of a prescribed organic phosphine (A) and a prescribed sulfide-based compound (B), the resin (M) comprises a thermosetting resin (M1), and has a storage elastic modulus at 1 Hz measured in a state after sintering of 20 GPa or less and a thermal weight loss ratio when heated for 2 hours at 250&#xb0; C. under a nitrogen atmosphere of less than 1%.

Electrically conductive adhesive film and dicing-die bonding film using the same

The electrically conductive adhesive film comprises a metal particle (Q), a resin (M), and a prescribed organophosphorus compound (A), the resin (M) comprises a thermosetting resin (M1), and the metal particle (Q) has an average particle size (d50) of 20 &#x3bc;m or less and comprise 10% by mass or more of a first metal particle (Q1) having a fractal dimension of 1.1 or more when viewed in a projection drawing in a primary particle state.

The electrically conductive adhesive film comprises a metal particle (P), a resin (M) and a prescribed sulfide compound (A), the resin (M) comprises a thermosetting resin (M1), and the metal particle (P) has an average particle size (d50) of 20 &#x3bc;m or less and comprises 10% by mass or more of a first metal particle (P1) having a fractal dimension of 1.1 or more when viewed in a projection drawing in a primary particle state.

Provided are a film-like adhesive that can prevent the back surface of a semiconductor chip, the front surface of a substrate, or the front surface of a heat sink from being partially fractured by a filler; and a method for producing a semiconductor package using the film-like adhesive. The film-like adhesive includes an epoxy resin (A), an epoxy resin curing agent (B), a phenoxy resin (C), and a heat-conductive filler material (D), in which the heat-conductive filler (D) has an average particle size of 0.1 to 10.0 &#x3bc;m, a compression ratio at break in a microcompression test of 5 to 50% of the average particle size of the sample, a fracture strength in a microcompression test of 0.01 to 2.0 GPa, and a thermal conductivity of 30 W/m&#xb7;K or higher, the content of component (D) is 10 to 70 vol % with respect to the total amount of the components (A) to (D), and the thermal conductivity after thermal curing is 1.0 W/m&#xb7;K or higher.

Film-like adhesive and method for producing semiconductor package using film-like adhesive

The electrically conductive adhesive film comprises a metal particle (P) and a resin (M), the resin (M) comprises a thermosetting resin (M1), and the metal particle (P) has an average particle size (d50) of 20 &#x3bc;m or less and comprises 10% by mass or more of a first metal particle (P1) having a fractal dimension of 1.1 or more when viewed in a projection drawing in a primary particle state.

A composition exhibits excellent heat resistance and mounting reliability when bonding a semiconductor power element to a metal lead frame, which is also free of lead and thereby places little burden on the environment. An electrically conductive composition contains at least a sulfide compound represented by R&#x2014;S&#x2014;R' (wherein R is an organic group containing at least carbon; R&#x2032; is an organic group that is the same as or different from R; and R and R&#x2032; may be bonded to each other to form a so-called cyclic sulfide) and metal particles containing at least Cu, Sn or Ni as its essential component. Further, a conductive paste and a conductive bonding film each are produced using the electrically conductive composition. A dicing die bonding film is obtained by bonding the conductive bonding film with an adhesive tape.

Electrically conductive composition

A conductive adhesive that does not contain toxic substances such as solder (lead) and shows excellent adhesiveness. Specifically, it is a conductive adhesive composition, which includes: (A) a thermosetting resin; (C) a filler that contains a metal element; and (D) at least one catalyst or curing agent, wherein the reaction initiation temperature for the (A) thermosetting resin and the (D) at least one catalyst or curing agent is 180&#xb0; C. or higher. More preferably, the reaction initiation temperature is 200&#xb0; C. or higher. More preferably, it is a conductive adhesive composition that further includes (B) a flux and (E) a polymer component.

Conductive adhesive composition

An adhesive film that can solve the problem of pickup defect and improve the yield rate of semiconductor packages. The adhesive film includes: (A) a bismaleimide resin; (B) a radical initiator; and (C) a coupling agent that contains a (meth)acrylic group. Further, an adhesive film with dicing tape, which includes such an adhesive film laminated onto a dicing tape, is provided. Furthermore, a semiconductor package that includes such an adhesive film with dicing tape is provided.

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Tokyo, Japan

Noriyuki Kirikae