The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 05, 2021
Filed:
Feb. 05, 2019
Furukawa Electric Co., Ltd., Tokyo, JP;
Minoru Morita, Tokyo, JP;
Noriyuki Kirikae, Tokyo, JP;
FURUKAWA ELECTRIC CO., LTD., Tokyo, JP;
Abstract
Provided are a film-like adhesive that can prevent the back surface of a semiconductor chip, the front surface of a substrate, or the front surface of a heat sink from being partially fractured by a filler; and a method for producing a semiconductor package using the film-like adhesive. The film-like adhesive includes an epoxy resin (A), an epoxy resin curing agent (B), a phenoxy resin (C), and a heat-conductive filler material (D), in which the heat-conductive filler (D) has an average particle size of 0.1 to 10.0 μm, a compression ratio at break in a microcompression test of 5 to 50% of the average particle size of the sample, a fracture strength in a microcompression test of 0.01 to 2.0 GPa, and a thermal conductivity of 30 W/m·K or higher, the content of component (D) is 10 to 70 vol % with respect to the total amount of the components (A) to (D), and the thermal conductivity after thermal curing is 1.0 W/m·K or higher.