The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 30, 2020
Filed:
Sep. 12, 2017
Applicant:
Furukawa Electric Co., Ltd., Tokyo, JP;
Inventors:
Yoshifumi Oka, Tokyo, JP;
Masami Aoyama, Tokyo, JP;
Assignee:
FURUKAWA ELECTRIC CO., LTD., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/68 (2006.01); H01L 21/78 (2006.01); H01L 21/683 (2006.01); C09J 7/22 (2018.01); H01L 21/3065 (2006.01); H01L 21/311 (2006.01);
U.S. Cl.
CPC ...
H01L 21/6836 (2013.01); C09J 7/22 (2018.01); H01L 21/3065 (2013.01); H01L 21/6831 (2013.01); H01L 21/78 (2013.01); C09J 2201/602 (2013.01); C09J 2201/622 (2013.01); C09J 2203/326 (2013.01); C09J 2205/114 (2013.01); C09J 2205/302 (2013.01); C09J 2423/046 (2013.01); C09J 2433/006 (2013.01); H01L 21/31138 (2013.01); H01L 2221/6834 (2013.01); H01L 2221/68327 (2013.01);
Abstract
A wafer-fixing tape, having: an temporary-adhesive layer provided on a substrate film, wherein the substrate film contains an ionomer resin comprising a terpolymer crosslinked by a metal ion, and wherein an arithmetic average roughness Ra of a surface of the substrate film opposite to the temporary-adhesive layeris from 0.1 to 3.0 μm; a processing method of a semiconductor wafer; and a semiconductor chip.