The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 17, 2019
Filed:
Sep. 12, 2017
Applicant:
Furukawa Electric Co., Ltd., Tokyo, JP;
Inventors:
Yoshifumi Oka, Tokyo, JP;
Masami Aoyama, Tokyo, JP;
Assignee:
FURUKAWA ELECTRIC CO., LTD., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/302 (2006.01); H01L 21/3065 (2006.01); H01L 21/78 (2006.01); H01L 23/00 (2006.01); H01L 21/683 (2006.01);
U.S. Cl.
CPC ...
H01L 21/6836 (2013.01); H01L 21/302 (2013.01); H01L 21/3065 (2013.01); H01L 21/78 (2013.01); H01L 24/27 (2013.01);
Abstract
A method of processing a semiconductor wafer, in which a mask is formed: by cutting, with COlaser, a portion corresponding to a street, out of a temporary-adhesive of a surface protective tape to protect on a patterned face; carrying out dicing with SFplasma; and carrying out ashing, by removing a layer of the temporary-adhesive, with Oplasma; a semiconductor chip; and a surface protective tape.