The Furukawa Electric Co., Ltd.

Masami Aoyama

Takumi Asanuma

Tetsuya Mieda

Keiji Saito

Naoaki Mihara

Noriyuki Kirikae

Yasushi Ishizaka

Jirou Sugiyama

Kunihiko Ishiguro

Hiromitsu Maruyama

Yoshifumi Oka

Toshimitsu Nakamura

A wafer-fixing tape, having: an temporary-adhesive layer provided on a substrate film, wherein the substrate film contains an ionomer resin comprising a terpolymer crosslinked by a metal ion, and wherein an arithmetic average roughness Ra of a surface of the substrate film opposite to the temporary-adhesive layeris from 0.1 to 3.0 &#x3bc;m; a processing method of a semiconductor wafer; and a semiconductor chip.

Wafer-fixing tape, method of processing a semiconductor wafer, and semiconductor chip

A conductive adhesive that does not contain toxic substances such as solder (lead) and shows excellent adhesiveness. Specifically, it is a conductive adhesive composition, which includes: (A) a thermosetting resin; (C) a filler that contains a metal element; and (D) at least one catalyst or curing agent, wherein the reaction initiation temperature for the (A) thermosetting resin and the (D) at least one catalyst or curing agent is 180&#xb0; C. or higher. More preferably, the reaction initiation temperature is 200&#xb0; C. or higher. More preferably, it is a conductive adhesive composition that further includes (B) a flux and (E) a polymer component.

Conductive adhesive composition

A method of processing a semiconductor wafer, in which a mask is formed: by cutting, with COlaser, a portion corresponding to a street, out of a temporary-adhesive of a surface protective tape to protect on a patterned face; carrying out dicing with SFplasma; and carrying out ashing, by removing a layer of the temporary-adhesive, with Oplasma; a semiconductor chip; and a surface protective tape.

Method of processing a semiconductor wafer, semiconductor chip, and surface protective tape

A resin composition for sealing an electronic device and other things being capable of suppressing the permeation of water vapor is provided. The present invention includes a polybutadiene polymer represented by chemical formula (1) and having a (meth)acryloyl group at a terminal end; and a photopolymerization initiator, and does not include a thermoplastic resin having a mass-average molecular weight of 50,000 or more: wherein Rand Reach represent a hydroxyl group or HC&#x2550;C(R)&#x2014;COO&#x2014;; Rand Reach represent a C1-C16 substituted or unsubstituted divalent organic group; R, Rand Reach represent a hydrogen atom or a C1-C10 alkyl group, and at least one organic group represented by chemical formula (2) is included within chemical formula (1); l and m each represent 0 or 1; n represents an integer of 15-150; and x:y=0 to 100:100 to 0; Rand Rare never both a hydroxyl group. 

Resin composition for sealing electronic device, and electronic device

A resin composition for sealing an electronic device and other things being capable of sealing an electronic device without trapping air and being capable of suppressing the permeation of water vapor is provided. The present invention includes a polybutadiene polymer represented by chemical formula (1) and having a (meth) acryloyl group at a terminal end; and a photopolymerization initiator, and does not include a thermoplastic resin having a mass-average molecular weight of 50,000 or more: wherein Rand Reach represent a hydroxyl group or HC&#x2550;C(R)&#x2014;COO&#x2014;; Rand Reach represent a C1-C16 substituted or unsubstituted, non-N-containing divalent organic group; R, Rand Reach represent a hydrogen atom or a C1-C10 alkyl group; l and m each represent 0 or 1; n represents an integer from 15 to 150; and x:y=0 to 100:100 to 0; Rand Rare never both a hydroxyl group.

An adhesive film that can solve the problem of pickup defect and improve the yield rate of semiconductor packages. The adhesive film includes: (A) a bismaleimide resin; (B) a radical initiator; and (C) a coupling agent that contains a (meth)acrylic group. Further, an adhesive film with dicing tape, which includes such an adhesive film laminated onto a dicing tape, is provided. Furthermore, a semiconductor package that includes such an adhesive film with dicing tape is provided.

Adhesive film and semiconductor package using adhesive film

Provided are a resin composition for element encapsulation for organic electronic devices which is transparent, has excellent flexibility, water vapor barrier properties, and adhesive force, and can suppress the generation of dark spots, a resin sheet for element encapsulation for organic electronic devices, an organic electroluminescent element, and an image display device. This adhesive resin composition for element encapsulation for organic electronic devices is used to seal an element for organic electronic devices, and is characterized by containing a diene polymer and a softening agent, in which the content of the softening agent is from 5% by mass to 30% by mass of the total mass.

Resin composition for element encapsulation for organic electronic devices, resin sheet for element encapsulation for organic electronic devices, organic electroluminescent element, and image display device

A transparent resin composition for sealing an organic EL element and other things having a sufficient effect of blocking moisture and excellent flexibility is provided. As essential components, a thermoplastic resin, tackifying resin and organometallic compound represented by the following chemical formula are included, having a light transmittance of 85% or more, and having a relationship of AM/Y&#x3c;162, 

Transparent resin composition for sealing organic electroluminescence element, resin sheet for sealing organic electroluminescence element, and apparatus for displaying image

The adhesive sheet wound into a roll includes: a long release film; an adhesive layer provided in a label form on the release film; and a pressure-sensitive adhesive film having a label part covering the adhesive layer and provided so as to be in contact with the release film around the adhesive layer and a peripheral part surrounding an outside of the label part, wherein a through hole penetrating the pressure-sensitive adhesive film is provided outside a portion corresponding to a part of the adhesive layer intended to be attached to an adherend and inside the label part, and wherein outer circumference of the adhesive layer&#xd7; 1/43&#x2266;maximum width of the through hole&#xd7;number of the through holes per label part of the pressure-sensitive adhesive film&#x2266;outer circumference of the adhesive layer is satisfied.

Adhesive sheet

An adhesive sheetwound into a roll includes: a long release film; an adhesive layerprovided in a label form on the release film; and a pressure-sensitive adhesive filmhaving a label partcovering the adhesive layerand provided so as to be in contact with the release filmaround the adhesive layerand a peripheral partsurrounding an outside of the label part, wherein a through holepenetrating the release filmis provided in a place including a portion corresponding to an outside of a partof the adhesive layerintended to be attached to an adherend and an inside of the label part

Growing community of inventors

Tokyo, Japan

Masami Aoyama