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For the Inventor, By the Inventor

Tokyo, Japan

Masahiko Sekimoto

This inventor holds 30 USPTO granted patents and 5 published patent applications, primarily in Substrate Processing. Top assignees: Ebara Corporation, Other. Active years: 2001-2018.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Masahiko Sekimoto. Retrieved from https://idiyas.com/inventor/masahiko-sekimoto

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 30 

% Patents Active = 60.0

Average Co-Inventor Count = 5.5

ph-index = 9

Forward Citations = 245(Granted Patents)


Location History:

  • Zushi, JP (2003)
  • Tokyo, JP (2001 - 2018)

Company Filing History:

goldMedal29 out of 2,573 
 
Ebara Corporation
 patents
silverMedal1 out of 834,453 
Other
 patents

Years Active: 2001-2018

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Areas of Expertise:
Substrate Processing
Cleaning Methods
Plating Techniques
Polishing Apparatus
Transfer Method
Substrate Holder
Substrate Apparatus
Processing Unit
Substrate Polishing
Transfer Apparatus
Substrate Holding
30 patents (USPTO):Explore Patents
1. 10160013 - Rinsing bath and substrate cleaning method using such rinsing bath (2018-12-25),
2. 10141211 - Substrate processing apparatus and substrate transfer method (2018-11-27),
3. 9786532 - Substrate processing apparatus and method of transferring a substrate (2017-10-10),
4. 8777198 - Substrate holding apparatus, substrate holding method, and substrate processing apparatus (2014-07-15),
5. 8225803 - Substrate processing method and apparatus (2012-07-24),
6. 8141513 - Substrate holding apparatus, substrate holding method, and substrate processing apparatus (2012-03-27),
7. 8133376 - Substrate holder, plating apparatus, and plating method (2012-03-13),
8. 8048282 - Apparatus and method for plating a substrate (2011-11-01),
9. 7976362 - Substrate polishing apparatus and method (2011-07-12),
10. 7959977 - Substrate processing method and apparatus (2011-06-14),
11. 7886685 - Substrate holding apparatus, substrate holding method, and substrate processing apparatus (2011-02-15),
12. 7807027 - Substrate holder, plating apparatus, and plating method (2010-10-05),
13. 7735451 - Substrate processing method and apparatus (2010-06-15),
14. 7735450 - Substrate holding apparatus (2010-06-15),
15. 7632378 - Polishing apparatus (2009-12-15),

Title: The Innovative Journey of Masahiko Sekimoto

Introduction:

Masahiko Sekimoto is a renowned inventor hailing from Tokyo, Japan, known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents:

Masahiko Sekimoto holds several patents in the areas of robotics, artificial intelligence, and renewable energy technologies, showcasing his versatility and forward-thinking approach to invention.

Career Highlights:

With a career spanning over two decades, Masahiko Sekimoto has worked with leading tech companies in Japan, spearheading projects that have revolutionized the industry. His keen eye for detail and passion for innovation have led to the development of cutting-edge solutions that have garnered international acclaim.

Collaborations:

Throughout his career, Masahiko Sekimoto has collaborated with top researchers, engineers, and scientists, fostering a culture of creativity and excellence. His ability to work seamlessly in multidisciplinary teams has resulted in the successful implementation of complex projects with real-world applications.

Conclusion:

In conclusion, Masahiko Sekimoto's dedication to pushing the boundaries of technology and his relentless pursuit of innovation have solidified his position as a trailblazer in the world of inventions. His work continues to inspire the next generation of inventors and serves as a testament to the power of creativity and perseverance in driving positive change.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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