The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 13, 2012
Filed:
Aug. 30, 2010
Junichiro Yoshioka, Tokyo, JP;
Seiji Katsuoka, Tokyo, JP;
Masahiko Sekimoto, Tokyo, JP;
Yasuhiko Endo, Tokyo, JP;
Yugang Guo, Tokyo, JP;
Junichiro Yoshioka, Tokyo, JP;
Seiji Katsuoka, Tokyo, JP;
Masahiko Sekimoto, Tokyo, JP;
Yasuhiko Endo, Tokyo, JP;
Yugang Guo, Tokyo, JP;
Ebara Corporation, Tokyo, JP;
Abstract
A plating method and a plating apparatus, which has a plurality of plating units, for plating a substrate. Each of the plating units includes a plating tank for containing a plating solution therein, a water cleaning tank, disposed adjacent to said plating tank for cleaning the substrate with water, a substrate holder for holding the substrate in a vertical orientation, a vertical displacing mechanism for vertically dipping the substrate holder and a substrate held thereby in the plating solution in the plating tank, and a lateral displacing mechanism or a back-and-forth displacing mechanism for moving the substrate holder while holding the substrate in a vertical orientation between the plating tank and the water cleaning tank. The plating unit also includes a loading/unloading station for loading and unloading the substrate, and a transfer device for transferring the substrate between the plating unit and the loading/unloading station.