The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 12, 2011
Filed:
Aug. 03, 2009
Seiji Katsuoka, Tokyo, JP;
Masahiko Sekimoto, Tokyo, JP;
Junji Kunisawa, Tokyo, JP;
Mitsuru Miyazaki, Tokyo, JP;
Teruyuki Watanabe, Tokyo, JP;
Kenichi Kobayashi, Tokyo, JP;
Masayuki Kumekawa, Tokyo, JP;
Toshio Yokoyama, Tokyo, JP;
Seiji Katsuoka, Tokyo, JP;
Masahiko Sekimoto, Tokyo, JP;
Junji Kunisawa, Tokyo, JP;
Mitsuru Miyazaki, Tokyo, JP;
Teruyuki Watanabe, Tokyo, JP;
Kenichi Kobayashi, Tokyo, JP;
Masayuki Kumekawa, Tokyo, JP;
Toshio Yokoyama, Tokyo, JP;
Ebara Corporation, Tokyo, JP;
Abstract
A substrate polishing apparatus includes a substrate holding mechanism having a head for holding a substrate to be polished, and a polishing mechanism including a polishing table with a polishing pad mounted thereon. The substrate held by the head is pressed against the polishing pad on the polishing table to polish the substrate by relative movement of the substrate and the polishing pad. The substrate polishing apparatus also includes a substrate transfer mechanism for delivering the substrate to be polished to the head and receiving the polished substrate. The substrate transfer mechanism includes a substrate to-be-polished receiver for receiving the substrate to be polished, and a polished substrate receiver for receiving the substrate which has been polished.