The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 15, 2010
Filed:
Nov. 14, 2003
Seiji Katsuoka, Tokyo, JP;
Masahiko Sekimoto, Tokyo, JP;
Toshio Yokoyama, Tokyo, JP;
Teruyuki Watanabe, Tokyo, JP;
Takahiro Ogawa, Tokyo, JP;
Kenichi Kobayashi, Tokyo, JP;
Mitsuru Miyazaki, Tokyo, JP;
Yasuyuki Motojima, Tokyo, JP;
Seiji Katsuoka, Tokyo, JP;
Masahiko Sekimoto, Tokyo, JP;
Toshio Yokoyama, Tokyo, JP;
Teruyuki Watanabe, Tokyo, JP;
Takahiro Ogawa, Tokyo, JP;
Kenichi Kobayashi, Tokyo, JP;
Mitsuru Miyazaki, Tokyo, JP;
Yasuyuki Motojima, Tokyo, JP;
Ebara Corporation, Tokyo, JP;
Abstract
A substrate processing method and apparatus can securely carry out a pre-plating treatment that enables uniform plating in the necessary area of the surface of a substrate. The substrate processing method carries out a cleaning treatment and a catalyst-imparting treatment of a surface of a substrate as pre-plating treatments and then electroless plates a metal film on the catalyst-imparted surface of the substrate. The cleaning treatment is carried out in a wider area of the surface of the substrate than that area to which a catalyst is imparted by the catalyst-imparting treatment.