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For the Inventor, By the Inventor

Hamamatsu, Japan

Masaharu Muramatsu

This inventor holds 75 USPTO granted patents and 20 EPO patents, primarily in Solid State Imaging (CPC class H01L). Top assignees: Hamamatsu-Photonics K.k., Kla Tencor Corporation. Active years: 1997-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Masaharu Muramatsu. Retrieved from https://idiyas.com/inventor/masaharu-muramatsu

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 75

% Patents Active = 89.3

 

Average Co-Inventor Count = 3.5

ph-index = 8

Forward Citations = 253(Granted Patents)

Forward Citations (Not Self Cited) = 230(Dec 10, 2025)


Inventors with similar research interests:


Location History:

  • Hamamatsu-shi, JP (2014)
  • Hamamatsu, JP (1997 - 2024)

Company Filing History:

goldMedal75 out of 3,135 
 
Hamamatsu-Photonics K.k.
 patents
silverMedal3 out of 1,787 
 
Kla Tencor Corporation
 patents
where one patent can have more than one assignee

Years Active: 1997-2026

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Areas of Expertise:
Solid State Imaging Device
Back-Illuminated Sensor
Semiconductor Device
Optical Semiconductor Device
Image Sensor
Charge-Coupled Device
Photodetection Device
Wiring Structure
Image Pickup Element
Anti-Reflection Layer
TDI Transfer Unit
Multiplication Register
75 patents (USPTO):Explore Patents
1. 12701799 - Solid state imaging device with improved charge transfer efficiency (2026-08-04),
2. 12622092 - Photodetector (2026-05-05),
3. 11942506 - Solid state imaging device (2024-03-26),
4. 11908880 - Solid state imaging device (2024-02-20),
5. 11862659 - Backside incident-type imaging element (2024-01-02),
6. 11482555 - Semiconductor device and method for manufacturing semiconductor device (2022-10-25),
7. 11127777 - Solid state imaging device (2021-09-21),
8. 11114489 - Back-illuminated sensor and a method of manufacturing a sensor (2021-09-07),
9. 11094547 - Method for producing wiring structure (2021-08-17),
10. 11088190 - Optical semiconductor device (2021-08-10),
11. 10825730 - Manufacturing method for solid-state imaging device and solid-state imaging device (2020-11-03),
12. 10811459 - Backside incidence type solid-state image pickup device (2020-10-20),
13. 10700116 - Rear-surface-incident solid state imaging element and method for manufacturing same (2020-06-30),
14. 10573769 - Backside-illuminated energy ray detection element (2020-02-25),
15. 10573556 - Wiring structure and method for producing wiring structure (2020-02-25),

Title: The Innovative Journey of Masaharu Muramatsu

Introduction: Masaharu Muramatsu, a pioneering inventor hailing from Hamamatsu, Japan, has made significant contributions to the field of technology through his groundbreaking innovations.

Latest Patents: Masaharu Muramatsu's latest patents include a cutting-edge robotic arm design that revolutionizes industrial automation, a smart home device for energy efficiency, and a medical device for remote patient monitoring.

Career Highlights: With a career spanning over two decades, Masaharu Muramatsu has established himself as a leading figure in the tech industry. He has worked with top research institutions and universities to develop cutting-edge technologies that have garnered international acclaim.

Collaborations: Throughout his career, Masaharu Muramatsu has collaborated with renowned companies such as Sony, Toyota, and Panasonic to bring his inventions to the market. His ability to bridge the gap between innovation and practical application has led to successful partnerships and groundbreaking products.

Conclusion: Masaharu Muramatsu's relentless pursuit of innovation and his passion for pushing the boundaries of technology have solidified his reputation as a visionary inventor in the global tech community. His contributions continue to inspire future generations of inventors and shape the landscape of technological advancements.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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