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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10573556 B1

PDFFull Text
Date of Patent:
Feb. 25, 2020

Filed:

Sep. 01, 2016

Wiring structure and method for producing wiring structure

Applicant:

Hamamatsu Photonics K.k., Hamamatsu-shi, Shizuoka, JP;

Inventors:

Masaharu Muramatsu, Hamamatsu, JP;

Hisanori Suzuki, Hamamatsu, JP;

Yasuhito Yoneta, Hamamatsu, JP;

Shinya Otsuka, Hamamatsu, JP;

Hirotaka Takahashi, Hamamatsu, JP;

Assignee:

HAMAMATSU PHOTONICS K.K., Hamamatsu-shi, Shizuoka, JP;

Attorney:

Drinker Biddle & Reath LLP

Primary Examiner:

Joseph C Nicely

Int. Cl.
CPC ...
H01L 21/768 (2006.01); H01L 23/48 (2006.01); H01L 23/498 (2006.01); H01L 23/538 (2006.01); H01L 21/48 (2006.01); H01L 23/14 (2006.01); H01L 21/3205 (2006.01); H01L 23/522 (2006.01); H05K 1/11 (2006.01); H01L 23/12 (2006.01); H01L 23/32 (2006.01); H05K 3/40 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76898 (2013.01); H01L 21/3205 (2013.01); H01L 21/486 (2013.01); H01L 23/12 (2013.01); H01L 23/14 (2013.01); H01L 23/32 (2013.01); H01L 23/481 (2013.01); H01L 23/49827 (2013.01); H01L 23/49872 (2013.01); H01L 23/522 (2013.01); H01L 23/5384 (2013.01); H05K 1/11 (2013.01); H05K 3/40 (2013.01);
Abstract

Provided is a wiring structural body provided with a wiring pattern including a through-wiring pattern, the wiring structural body including: a silicon substrate having a through hole in which the through-wiring pattern is disposed; an insulating layer provided on a surface of the silicon substrate including an inner surface of the through hole along at least the wiring pattern; a boron layer provided on the insulating layer along the wiring pattern; and a metal layer provided on the boron layer.

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