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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11094547 B1

PDFFull Text
Date of Patent:
Aug. 17, 2021

Filed:

Sep. 01, 2016

Method for producing wiring structure

Applicant:

Hamamatsu Photonics K.k., Hamamatsu, JP;

Inventors:

Masaharu Muramatsu, Hamamatsu, JP;

Hisanori Suzuki, Hamamatsu, JP;

Yasuhito Yoneta, Hamamatsu, JP;

Shinya Otsuka, Hamamatsu, JP;

Hirotaka Takahashi, Hamamatsu, JP;

Assignee:

HAMAMATSU PHOTONICS K.K., Hamamtsu, JP;

Attorney:

Faegre Drinker Biddle & Reath LLP

Primary Examiner:

Mohammad M Choudhry

Int. Cl.
CPC ...
H01L 21/288 (2006.01); C23C 18/18 (2006.01); H01L 23/14 (2006.01); C23C 18/16 (2006.01); H01L 23/12 (2006.01); H01L 23/498 (2006.01); H01L 21/768 (2006.01); H01L 21/48 (2006.01); H01L 21/3205 (2006.01); H01L 23/522 (2006.01);
U.S. Cl.
CPC ...
H01L 21/288 (2013.01); C23C 18/16 (2013.01); C23C 18/18 (2013.01); H01L 21/3205 (2013.01); H01L 21/486 (2013.01); H01L 21/76874 (2013.01); H01L 21/76898 (2013.01); H01L 23/12 (2013.01); H01L 23/14 (2013.01); H01L 23/147 (2013.01); H01L 23/49805 (2013.01); H01L 23/49827 (2013.01); H01L 23/49866 (2013.01); H01L 23/522 (2013.01);
Abstract

Provided is a method for producing a wiring structural body provided with a wiring pattern, the method including a first step of forming an insulating layer on a surface of a silicon substrate along at least a region for forming the wiring pattern, a second step of forming a boron layer on the insulating layer along the region, and a third step of forming a metal layer on the boron layer by plating.

Find Patent Forward Citations

Muramatsu, Masaharu. (2021). Method for producing wiring structure (U.S. Patent No. 11094547). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11094547

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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