This inventor holds 22 USPTO granted patents and 1 EPO patent. Top assignees: Infineon Technologies Ag, Qimonda Ag. Active years: 2002-2011.
Location History:
- Regensburg, DE (2002 - 2006)
- Medingen, DE (2005 - 2006)
- Ottendorf-Okrilla OT Medingen, DE (2006 - 2007)
- Ottendorf-Okrilla, DE (2007)
- Dresden, DE (2007 - 2011)
Company Filing History:
Years Active: 2002-2011
Title: Martin Reiss: Innovator in Semiconductor Packaging
Introduction
Martin Reiss, an accomplished inventor based in Dresden, Germany, has made significant contributions to the field of semiconductor technology. With a total of 22 patents, Reiss’s work focuses on innovations that enhance the performance and reliability of electronic components.
Latest Patents
Among his latest patents, Martin Reiss has developed a "Method for applying solder to redistribution lines." This invention outlines a process for making electronic components where an electrically conductive redistribution line is formed on the surface of a semiconductor chip. The method incorporates a solder pad, with a covering material that passivates the uncovered portion of the redistribution line while preventing passivation of the solder pad itself. This innovation allows for enhanced solder properties, improving the functionality of electronic devices.
Another notable patent is for a "Package for semiconductor components and method for producing the same." This invention pertains to semiconductor packaging, particularly FBGA packages in BOC technology. The packaging design includes a mold coating that seals the back and lateral edges of a chip mounted on a substrate. Importantly, it reduces thermomechanical stress while improving adhesion between the mold coating and substrate, facilitating a higher package load. The substrate features a spongy structure with pore-type openings, allowing the molding material to penetrate by capillary attraction, thus enhancing the overall performance of the semiconductor package.
Career Highlights
Throughout his career, Martin Reiss has been associated with prominent companies such as Infineon Technologies and Qimonda AG. His work with these organizations has positioned him as a key player in the advancement of semiconductor technology and packaging innovations.
Collaborations
Martin has also collaborated with notable professionals such as Christian Hauser and Johann Winderl. These partnerships have fostered a productive environment for innovation and research, enabling the development of advanced solutions in the semiconductor arena.
Conclusion
Martin Reiss stands out as a leading inventor in the realm of semiconductor technology, with a robust portfolio of patents that reflect his commitment to innovation. His contributions have not only advanced the field but have also laid the groundwork for future developments in electronic components and packaging solutions.