The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 14, 2006
Filed:
Jun. 17, 2004
Applicant:
Martin Reiss, Medingen, DE;
Inventor:
Martin Reiss, Medingen, DE;
Assignee:
Infineon Technologies AG, Munich, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/44 (2006.01); H01L 21/48 (2006.01); H01L 21/50 (2006.01);
U.S. Cl.
CPC ...
Abstract
The invention relates to an electronic component and to a method for its production. The electronic component has a semiconductor chip and a wiring board, and a plastic package. The plastic package is divided into two plastic package molding compounds arranged one on top of the other. Of the plastic package molding compounds a first layeroof plastic package molding compound forms a relatively uneven surface, which is smoothed by a second layer of plastic package molding compound so that the electronic component has smooth outer sides of the plastic package.