The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 27, 2005
Filed:
Jun. 02, 2004
Applicants:
Martin Reiss, Medingen, DE;
Alfred Haimerl, Sinzing, DE;
Steffen Kroehnert, Dresden, DE;
Inventors:
Assignee:
Infineon Technologies AG, Munich, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L023/04 ; H01L023/12 ; H01L023/22 ; H01L023/24 ;
U.S. Cl.
CPC ...
Abstract
The invention relates to a substrate-based chip package, comprising a substrate on which a chip is fastened by a die-attach material. The substrate is provided with a solder resist (on both sides) and, on the side that is opposite from the chip, has conductor tracks which are provided with solder balls and are connected to the chip by means of wire bridges which extend through a bonding channel which is sealed with a glob top. The chip and the substrate on the chip side being encapsulated by a molded cap.